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  1. FlipChips Dot Com free micropackaging information

    A free, neutral source providing micropackaging tutorials,articles, abstracts, technology updates, photographs, newsletter, supplier directory
    CSP1
    MEMS1
    microelectronics1
    optoelectronics1
    flip chip1
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    conductive adhesives1
    underfill1
    chip scale package1
    wafer bumping1
    conductive adhesive1
    nano-optics1
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    ball bumping1
    underfills1
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    single chip flipchip1
    stud bumping1
    wafer-level packaging1
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    bumped wafers0
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    flip chip abstracts0
    flip chip articles0
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    flip chip information0
    flipchip information0
    flip chip literature0

    www.flipchips.com - 2009-02-04

  2. International Micro Industries, Inc.

    International Micro Industries (IMI) offers state of the art Wafer Bumping and Wafer Level Packaging WLP contract services via high aspect ratio, high precision ...
    Gold4
    TAB2
    Electroplating1
    FlipChip1
    UBM1
    WLP1
    Wafer Bumping1
    Known Good Die1
    Copper electroplating1
    Solder Bumping1
    Thick Photoresist1
    Advanced Chip Packaging0
    Au Bumping0
    Bare Die Packaging0
    Copper Pillar Bumps0
    Fine Pitch Bumps0
    Flip Chip Packaging0
    Gold Bump0
    Gold Bumping0
    Indium Bumping0
    Indium Bumps0
    Known Good Packaging0
    Pillar Bumps0
    Sn Bumping0
    Sn Bumps0
    Solder Bumps0
    Tape Automated Bonding0
    Tin Bumps0
    Tin Lead Bumps0
    Wafer Electroplating0
    Wafer Level Processing0

    www.imi-corp.com - 2009-02-06

  3. 1Talon Semiconductors

    1Talon semiconductor has a robust DI process for real world analog bipolar design requirements Rad Hard. Combines with their unique patented packaging ...
    design7
    Package3
    Ball3
    silicon valley2
    Ultra2
    Analog2
    amplifier2
    Semiconductor2
    harris2
    bipolar2
    foundry2
    RCA2
    ASIC1
    MEMS1
    Bump1
    arrays1
    FOC1
    Flip chip1
    Milspec1
    Flipchip1
    power semiconductor1
    Wafer bumping1
    moats1
    Solder bumping1
    Solder bump1
    UCSP1
    Wafer Bump1
    dielectrically isolated0
    DI process0
    Solder flip chip0

    www.1talon.com - 2009-02-07

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